Publication - 2017 IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Publication - Young-woo Lee, e

Author
comsys
Date
2017-09-19 13:55
Views
416
In October 2017,
"Grouping-based TSV Test Architecture for Resistive Open and Bridge Defects in 3D-ICs" written by Young-woo Lee, Hyeonchan Lim, Sungho Kang,
has been published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.36, no.10, pp.1759-1763.

Authors' hard work has finally paid off !