• Parallel processing: high-performance computing (HPC), bio processor
  • Artificial intelligence (AI): Deep neural network, AI chip
  • Reliability: automotive IC

  • Test methodology: reduced pin count test (RPCT), massive parallel test (MPT)
  • Through silicon via (TSV): test structure, coupling estimation, test optimization, TSV repair
  • New trends: software-based self test (SBST), near-threshold voltage (NTV) test

  • Scan test: compression, low power scan test
  • Methodology: test access mechanism, DFT utility development, diagnosis
  • Post-silicon debug: embedded logic analyzer (ELA), error detection

  • Memory test: memory built-in self test (MBIST), 3D-DRAM control
  • Memory repair: RA, built-in RA (BIRA)
  • High speed test methodology: built-off self test (BOST), timing formatter chip (TFC)