2021 ISOCC Presentations
Author
comsys
Date
2021-11-01 16:23
Views
226
The following papers have been presented in ISOCC 2021
Title: Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory
Authors: Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
Title: An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA
Authors: Seung Ho Shin, Hayoung Lee. Younwoo Yoo, Sungho Kang
Title: Secure Scan Design through Pseudo Fault Injection
Authors: Seokjun Jang, Hyungil Woo, Sunghoon Kim, Sungho Kang
Title: Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure
Authors: Youngki Moon, Hyunho Yoo, Donghyun Han, Sungho Kang
Title: Hybrid Test Access Mechanism for Multiple Identical Cores
Authors: Sangjun Lee, Jongho Park, Inhwan Lee, Kwonhyoung Lee, Sungho Kang
Title: Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC
Authors: Donghyun Han, Youngkwang Lee, Sooryeong Lee, Sungho Kang
Title: A Circular-based TSV Repair Architecture
Authors: Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
Congratulations to the authors
Title: Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory
Authors: Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
Title: An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA
Authors: Seung Ho Shin, Hayoung Lee. Younwoo Yoo, Sungho Kang
Title: Secure Scan Design through Pseudo Fault Injection
Authors: Seokjun Jang, Hyungil Woo, Sunghoon Kim, Sungho Kang
Title: Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure
Authors: Youngki Moon, Hyunho Yoo, Donghyun Han, Sungho Kang
Title: Hybrid Test Access Mechanism for Multiple Identical Cores
Authors: Sangjun Lee, Jongho Park, Inhwan Lee, Kwonhyoung Lee, Sungho Kang
Title: Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC
Authors: Donghyun Han, Youngkwang Lee, Sooryeong Lee, Sungho Kang
Title: A Circular-based TSV Repair Architecture
Authors: Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
Congratulations to the authors