Publication - 2021 IEEE Transactions on Very Large Scale Integration Systems Acceptance - Jungil Mok, etc.

Author
comsys
Date
2021-06-05 16:20
Views
123
In June 2021,
"Enhanced Post-bond Test Architecture for Bridge Defects Between the TSVs" written by Jungil Mok, Hyunchan Lim and Sungho Kang has been published in the IEEE Transactions on Very Large Scale Integration Systems, vol.29, pp.1164-1177.

Authors' hard work has finally paid off !