 |
Name | Jungil Mok(목정일) | |
| mcmok78@gmail.com | |||
| Work | Samsung Electronics | ||
| Thesis | Enhanced Post-bond Test Architecture for Bridge Defects Between the TSVs | ||
| Hobby | Taking pictures | ||
동문석사- 목정일
About the Author: comsys
동문석사- 목정일
|
Name | Jungil Mok(목정일) | |
| mcmok78@gmail.com | |||
| Work | Samsung Electronics | ||
| Thesis | Enhanced Post-bond Test Architecture for Bridge Defects Between the TSVs | ||
| Hobby | Taking pictures | ||
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