2024 IEEE Transactions on Reliability Acceptance - Donghyun Han, etc.
Author
comsys
Date
2024-08-01 10:53
Views
174
The following paper has been accepted in the IEEE Transactions on Reliability in July 2024.
Congratulations to the authors.
Title: TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM
Authors: Donghyun Han, Duyeon Won, Sunghoon Kim, and Sungho Kang
Congratulations to the authors.
Title: TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM
Authors: Donghyun Han, Duyeon Won, Sunghoon Kim, and Sungho Kang