2016 ISOCC Best Paper Award

Author
comsys
Date
2016-10-28 16:59
Views
554
Oct, 2016 in International SOC Design Conference

The following paper has received "Best Paper" Award.

"A TSV Test Structure for Simultaneously Detecting Resistive Open and Bridge Defects in 3D-ICs"

Congratulations to the authors, Young-woo Lee, Junghwan Kim, Inhyuk Choi, Sungho Kang