2016 ISOCC Best Paper Award
Author
comsys
Date
2016-10-28 16:59
Views
1135
Oct, 2016 in International SOC Design Conference
The following paper has received "Best Paper" Award.
"A TSV Test Structure for Simultaneously Detecting Resistive Open and Bridge Defects in 3D-ICs"
Congratulations to the authors, Young-woo Lee, Junghwan Kim, Inhyuk Choi, Sungho Kang
The following paper has received "Best Paper" Award.
"A TSV Test Structure for Simultaneously Detecting Resistive Open and Bridge Defects in 3D-ICs"
Congratulations to the authors, Young-woo Lee, Junghwan Kim, Inhyuk Choi, Sungho Kang