2016 IEEE TCAD Acceptance - Youngwoo Lee, etc.

Author
comsys
Date
2016-09-10 10:03
Views
513
"Grouping-based TSV Test Architecture for Resistive Open and Bridge Defects in 3D-ICs" has been
accepted to IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Congratulations to the authors, Youngwoo Lee, Hyeonchan Lim, Sungho Kang.