2017 IEEE Transactions on Reliability Acceptance - Jaeseok Park, etc.

Author
comsys
Date
2017-03-29 15:13
Views
441
The following paper has been accepted in the IEEE Transactions on Reliability, in March 2017.
Congratulations to the authors.
Title: R2-TSV: A Repairable and Reliable TSV Set Structure Reutilizing Redundancies
Authors: Jaeseok Park, Minho Cheong, Sungho Kang