2013년 ATS 및 ISOCC 발표 예정

Author
comsys
Date
2014-09-04 16:17
Views
676
ATS:

제목: A Die Selection and Matching Method with Two Stages for Yield Enhancement of 3-D Memories, ATS accepted
저자: 강우헌


ISOCC :

제목: An Efficient RPCT based on Test Data Compression using Burst Clock Controller in 3D-IC, ISOCC 2013 accepted
저자: 이용

제목: Scan chain swapping using TSVs for test power reduction in 3D-IC, ISOCC 2013 accepted
저자: 이인걸

제목: Efficient TSV repair method for 3D memories, ISOCC 2013 accepted
저자: 김일웅

제목: Test scheduling Using Ant Colony Optimization for 3D Integrated Circuits, ISOCC 2013 accepted
저자: 최인혁

논문 발표를 축하드립니다.