Publication - 2023 IEEE TCAD - Hayoung Lee, etc.
Author
comsys
Date
2023-06-30 13:07
Views
182
In June 2023,
"TRUST: Through-Silicon Via Repair Using Switch Matrix Topology" written by Hayoung Lee; Seung Ho Shin; Younwoo Yoo; Sungho Kang has been published in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.42, no.7, pp.2377-2390.
Authors' hard work has finally paid off !
"TRUST: Through-Silicon Via Repair Using Switch Matrix Topology" written by Hayoung Lee; Seung Ho Shin; Younwoo Yoo; Sungho Kang has been published in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.42, no.7, pp.2377-2390.
Authors' hard work has finally paid off !