2022 International Patent - Hayoung Lee, etc.

Author
comsys
Date
2022-08-02 19:50
Views
23
The following patent has been approved by the World Intellectual Property Office in July 2022.
Congratulations to the authors.

Title: METHOD AND APPARATUS FOR BUILT IN REDUNDANCY ANALYSIS WITH DYNAMIC FAULT RECONFIGURATION(동적 고장 재배치에 따른 메모리 수리 솔루션 탐색 장치 및 방법)

Authors: Hayoung Lee, Sungho Kang