Publication - 2022 IEEE TCAD - Sangmin Park, etc.

Author
comsys
Date
2022-03-20 17:36
Views
59
In April 2022,
"Herringbone Based TSV Architecture for Clustered Fault Repair and Aging Recovery" written by Sangmin Park, Minho Cheong, Donghyun Han, and Sungho Kang has been published in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.41, pp.1142-1153.

Authors' hard work has finally paid off !