2021 IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Acceptance - Sangmin Park, etc.

Author
comsys
Date
2021-04-22 13:40
Views
97
The following paper has been accepted in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems in April 2021.
Congratulations to the authors.
Title: Herringbone Based TSV Architecture for Clustered Fault Repair and Aging Recovery
Authors: Sangmin Park, Minho Cheong, Donghyun Han, and Sungho Kang