2026 International Patent - Youngkwang Lee, etc.
Author
comsys
Date
2026-07-31 16:17
Views
16
The following patent has been approved by the World Intellectual Property Office in May 2026.
Congratulations to the authors.
Title: SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA (TSV) TEST DEVICE AND OPERATING METHOD THEREOF
Authors: 강성호, 이영광
Congratulations to the authors.
Title: SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA (TSV) TEST DEVICE AND OPERATING METHOD THEREOF
Authors: 강성호, 이영광