2026 IEEE TR Acceptance - Donghyun Han, etc.
Author
comsys
Date
2026-03-31 17:18
Views
83
The following paper has been accepted in the IEEE Transactions on Reliability in March 2026.
Congratulations to the authors.
Title: A Dual-Mode Online BISR Architecture for Interconnect and Memory Repair in Chiplet-Based Systems
Authors: Donghyun Han, Sooryeong Lee, Jongho Park, Dayoung Kim, Seungtae Kim, Youngkwang Lee and Sungho Kang
Congratulations to the authors.
Title: A Dual-Mode Online BISR Architecture for Interconnect and Memory Repair in Chiplet-Based Systems
Authors: Donghyun Han, Sooryeong Lee, Jongho Park, Dayoung Kim, Seungtae Kim, Youngkwang Lee and Sungho Kang