Publication - 2025 IEEE Transactions on Reliability - Donghyun Han, etc.
Author
comsys
Date
2025-10-02 11:43
Views
29
In September 2025,
"TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM" written by Donghyun Han, Duyeon Won, Sunghoon Kim, and Sungho Kang has been published in the IEEE Transactions on Reliability, vol.74, no.3, pp.4143-4157.
Authors' hard work has finally paid off !
"TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM" written by Donghyun Han, Duyeon Won, Sunghoon Kim, and Sungho Kang has been published in the IEEE Transactions on Reliability, vol.74, no.3, pp.4143-4157.
Authors' hard work has finally paid off !