2013년 2학기 졸업연구 우수작 수상
Author
comsys
Date
2014-09-04 16:50
Views
1329
인턴과정 오형교 연구원이 졸업연구 우수작으로 선정되어 삼성디스플레이 상을 수여하였습니다.
축하드립니다.
Title:
Effective DfT Methodology for 3D Integrated Circutis
Abstract:
• The 3D integration technology using Through-Silicon Via (TSV) provides many advantages over 2D integration technology, such as high functionality, low power, small form factor, and so on.
• However, in 3D integration technology, there are some new challenges and especially, test challenges are very important. Because the testing of 3D IC is different with 2D IC significantly, so there are new test challenges.
• In this research, new effective DfT architecture is introduced. This 3D DfT satisfy (1) few number of test pad , (2) re-use architecture in pre and post bond test and (3) reducing test time.
축하드립니다.
Title:
Effective DfT Methodology for 3D Integrated Circutis
Abstract:
• The 3D integration technology using Through-Silicon Via (TSV) provides many advantages over 2D integration technology, such as high functionality, low power, small form factor, and so on.
• However, in 3D integration technology, there are some new challenges and especially, test challenges are very important. Because the testing of 3D IC is different with 2D IC significantly, so there are new test challenges.
• In this research, new effective DfT architecture is introduced. This 3D DfT satisfy (1) few number of test pad , (2) re-use architecture in pre and post bond test and (3) reducing test time.