2016 ISOCC Presentations
Author
comsys
Date
2016-10-28 16:57
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1067
The following papers have been presented in ISOCC 2016
Title: Software-Based Embedded Core Test Using Multi-Polynomial for Test Data Reduction
Authors: Soyeon Kang, Inhyuk Choi, Hyeonchan Lim, Sungyoul Seo, Sungho Kang
Title: Discussion of Cost-effective Redundancy Architectures
Authors: Keewon Cho, Jooyoung Kim, Hayoung Lee, Sungho Kang
Title: Process Variation-aware Bridge Fault Analysis
Authors: Heetae Kim, Inhyuk Choi, Jaeil Lim, Hyunggoy Oh, Sungho Kang
Title: A Test Methodology to Screen Scan-Path Failures
Authors: Junghwan Kim, Young-woo Lee, Minho Cheong, Sungyoul Seo and Sungho Kang
Title: P-Backtrace A New Scan Chain Diagnosis Method with Probability
Authors: Tae Hyun Kim, Hyun Yul Lim, Sungho Kang
Title: A TSV Test Structure for Simultaneously Detecting Resistive Open and Bridge Defects in 3D-ICs
Authors: Young-woo Lee, Junghwan Kim, Inhyuk Choi, Sungho Kang
Congratulations to the authors
Title: Software-Based Embedded Core Test Using Multi-Polynomial for Test Data Reduction
Authors: Soyeon Kang, Inhyuk Choi, Hyeonchan Lim, Sungyoul Seo, Sungho Kang
Title: Discussion of Cost-effective Redundancy Architectures
Authors: Keewon Cho, Jooyoung Kim, Hayoung Lee, Sungho Kang
Title: Process Variation-aware Bridge Fault Analysis
Authors: Heetae Kim, Inhyuk Choi, Jaeil Lim, Hyunggoy Oh, Sungho Kang
Title: A Test Methodology to Screen Scan-Path Failures
Authors: Junghwan Kim, Young-woo Lee, Minho Cheong, Sungyoul Seo and Sungho Kang
Title: P-Backtrace A New Scan Chain Diagnosis Method with Probability
Authors: Tae Hyun Kim, Hyun Yul Lim, Sungho Kang
Title: A TSV Test Structure for Simultaneously Detecting Resistive Open and Bridge Defects in 3D-ICs
Authors: Young-woo Lee, Junghwan Kim, Inhyuk Choi, Sungho Kang
Congratulations to the authors