2022 IEEE TCAD Acceptance - Hayoung Lee, etc.
Author
comsys
Date
2022-11-30 10:33
Views
246
The following paper has been accepted in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems in November 2022.
Congratulations to the authors.
Title: TRUST: Through-Silicon Via Repair Using Switch Matrix Topology,
Authors: Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang
Congratulations to the authors.
Title: TRUST: Through-Silicon Via Repair Using Switch Matrix Topology,
Authors: Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang