21 |
"THREE DIMENTIONAL INTEGRATED CIRCUIT HAVING REDUNDANT THROUGH SILICON VIA BASED ON ROTATABLE CUBE"
|
20 |
"CIRCUIT FOR TESTING AND ANALYZING TSV AND METHOD OF TESTING THE SAME"
|
19 |
"THREE-DIMENSIONAL INTEGRATED CIRCUIT"
|
18 |
"TEST CIRCUIT FOR 3D SEMICONDUCTOR DEVICE AND METHOD FOR TESTING THEREOF"
|
17 |
"SEMICONDUCTOR DEVICE AND METHOD FOR TESTING THE SAME"
|
16 |
"VOLTAGE ISLAND FORMATION FOR 3D MANY-CORE CHIP MULTIPROCESSOR"
|
15 |
"METHOD AND DEVICE FOR REPAIRING MEMORY (메모리 수리 방법 및 메모리 수리 장치)"
|
14 |
"SEMICONDUCTOR DEVICE AND METHOD FOR TESTING THE SAME"
|
13 |
"MULTI-CORE DEVICE, TEST DEVICE AND METHOD FOR DIAGNOSING FAILURE"
|
12 |
"Matching method of diagnosing multiple stuck-at faults"
|
[1][2][3][4] |