30

"SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA (TSV) TEST DEVICE AND OPERATING METHOD THEREOF"
Inventors : 강성호, 이영광
Application Number : 17/875,889, Filing Date : 2022.07.28
Country : 미국

29

"METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE AND SEMICONDUCTOR DEVICE"
Inventors : 강성호, 이영광
Application Number : 202210792232.X, Filing Date : 2022.07.11
Country : 중국

28

" METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE PERFORMING THE SAME AND SEMICONDUCTOR DEVICE INCLUDING THE SAME"
Inventors : 강성호, 이영광
Application Number : 17/660,920, Filing Date : 2022.04.07
Country : 미국

27

"SCAN APPARATUS CAPABLE OF FAULT DIAGNOSIS AND SCAN CHAIN FAULT DIAGNOSIS METHOD"
Inventors : 강성호, 장석준
Application Number : 17/673.075, Filing Date : 2022.02.16
Country : 미국

26

"REDUDANCY ANALYSIS METHOD AND REDUDANCY ANALYSIS APPARATUS"
Inventors : 강성호, 김태현
Application Number : 17/508910, Filing Date : 2021.10.22
Country : 미국

25

"ON-CHIP SECURITY CIRCUIT FOR DETECTING AND PROTECTING AGAINST INVASIVE ATTACKS"
Inventors : 강성호, 이영우
Application Number : 16/877100, Filing Date : 2020.05.18
Country : 미국

24

"METHOD AND APPARATUS FOR BUILT IN REDUNDANCY ANALYSIS WITH DYNAMIC FAULT RECONFIGURATION"
Inventors : 강성호, 이하영
Application Number : 16/877109, Filing Date : 2020.05.18
Country : 미국

23

"STACKED MEMORY APPARATUS USING ERROR CORRECTION CODE AND REPAIR METHOD THEREOF"
Inventors : 강성호, 한동현, 이하영
Application Number : 16/750,923, Filing Date : 2020.01.23
Country : 미국

22

"STACKED MEMORY DEVICE USING BASE DIE SPARE CELL AND METHOD OF REPAIRING THE SAME"
Inventors : 강성호, 한동현
Application Number : 15/988,970, Filing Date : 2018.05.24
Country : 미국

21

"THREE DIMENTIONAL INTEGRATED CIRCUIT HAVING REDUNDANT THROUGH SILICON VIA BASED ON ROTATABLE CUBE"
Inventors : 강성호, 정민호
Application Number : 15/894,787, Filing Date : 2018.02.12
Country : 미국