198 |
"Pair-Grouping Scan Chain Architecture for Multiple Scan Cell Fault Diagnosis"
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197 |
"Correlation Aware Random Pattern Generation for Test Time and Shift Power Reduction of Logic BIST"
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196 |
"FAME: Fault Address Memory Structure for Repair Time Reduction"
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195 |
"A Circular-based TSV Repair Architecture"
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194 |
"Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC"
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193 |
"Hybrid Test Access Mechanism for Multiple Identical Cores"
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192 |
"Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure"
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191 |
"Secure Scan Design through Pseudo Fault Injection"
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190 |
"An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA"
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189 |
"Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory"
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