195

"A Circular-based TSV Repair Architecture"
Youngkwang Lee, Donghyun Han, Sooryeong Lee, and Sungho Kang
International SOC Design Conference (ISOCC 2021)
OCT 2021

194

"Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC"
Donghyun Han, Youngkwang Lee, Sooryeong Lee, and Sungho Kang
International SOC Design Conference (ISOCC 2021)
OCT 2021

193

"Hybrid Test Access Mechanism for Multiple Identical Cores"
Sangjun Lee, Jongho Park, Inhwan Lee, Kwonhyoung Lee, and Sungho Kang
International SOC Design Conference (ISOCC 2021)
OCT 2021

192

"Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure"
Youngki Moon, Hyunho Yoo, Donghyun Han, and Sungho Kang
International SOC Design Conference (ISOCC 2021)
OCT 2021

191

"Secure Scan Design through Pseudo Fault Injection"
Seokjun Jang, Hyungil Woo, Sunghoon Kim, and Sungho Kang
International SOC Design Conference (ISOCC 2021)
OCT 2021

190

"An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA"
Seung Ho Shin, Hayoung Lee. Younwoo Yoo, and Sungho Kang
International SOC Design Conference (ISOCC 2021)
OCT 2021

189

"Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory"
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, and Sungho Kang
International SOC Design Conference (ISOCC 2021)
OCT 2021

188

"Fail Memory Configuration Set for RA Estimation"
Hayoung Lee, Keewon Cho, and Sungho Kang, Wooheon Kang, Seungtaek Lee, and Woosik Jeong
IEEE International Test Conference(ITC)
NOV 2020

187

"Diagnosis of Scan Chain Faults Based-on Machine-Learning"
Hyeonchan Lim, Tae Hyun Kim, Seunghwan Kim and Sungho Kang
International SOC Design Conference (ISOCC 2020)
OCT 2020

186

"Redundancy Analysis Optimization with Clustered Known Solutions for High Speed Repair "
Hayoung Lee, Donghyun Han, Hogyeong Kim, and Sungho Kang
International SOC Design Conference (ISOCC 2020)
OCT 2020


[1][2][3][4][5][6][7][8][9][10] Next Page>>