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160	"Highly Reliable Redundant TSV Architecture for Clustered Faults" Ingeol Lee, Minho Cheong, Sungho Kang IEEE Transactions on Reliability vol.68, no.1, pp.237-247, March 2019
159	"An Efficient BIRA Utilizing Characteristics of Spare Pivot Faults" Keewon Cho, Young-woo Lee, Sungyoul Seo, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.38, no.3, pp.551-561 , March 2019
158	"TSV Repair Architecture for Clustered Faults" Jaewon Jang, Minho Cheong, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.38, no.1, pp.190-194 , January 2019
157	"Test Resource Reused Debug Scheme to Reduce the Post-Silicon Debug Cost" Inhyuk Choi, Hyunggoy Oh, Young-woo Lee, Sungho Kang IEEE Transactions on Computers vol.67, no.12, pp1835-1839, December 2018
156	"A Statistic-based Scan Chain Reordering for Energy-Quality Scalable Scan Test " Sungyoul Seo, Keewon Cho, Young-woo Lee, Sungho Kang IEEE Journal on Emerging and Selected Topics in Circuits and Systems vol.8, no.3, pp 391-403, September 2018
155	"A debug scheme to improve the error identification in post-silicon validation" Inhyuk Choi, Won Jung, Hyunggoy Oh, Sungho Kang PLoS One vol.13, no.9, e0202216, September 2018
154	"Fault Group Pattern Matching with Efficient Early Termination for High-Speed Redundancy Analysis" Hayoung Lee, Kiwon Cho, Donghyun Kim, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.37, no.7, pp.1473-1482, July 2018
153	"Thermal Aware Test Scheduling for NTV Circuit " Jaeil Lim, Hyunggoy Oh, Heetae Kim, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.37, no.4, pp.906-910, March 2018
152	"Fast Built-in Redundancy Analysis Based on Sequential Spare Line Allocation" Hayoung Lee, Jooyoung Kim, Keewon Cho, Sungho Kang IEEE Transactions on Reliability vol.67, no.1, pp.264-273, March 2018
151	"An Area-efficient BIRA with 1D Spare Segments" Donghyun Kim, Hayoung Lee, Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.26, no.1, pp.206-210, January 2018

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