206

"Effective Parallel Redundancy Analysis Using GPU for Memory Repair"
Seung Ho Shin, Hayoung Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
To be Published

205

"A New Pipelined Output Data Reducer of BOST for Improved Parallelism"
Sooryeong Lee, Hayoung Lee, Juyong Lee, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be Published

204

"TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM"
Donghyun Han, Duyeon Won, Sunghoon Kim, and Sungho Kang
IEEE Transactions on Reliability
To be Published

203

"PASS: Pattern-Sequence-Authentication-based Secure Scan against Reverse Engineering Attacks"
Seokjun Jang, Youngki Moon, Duyeon Won, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be Published

202

"PETRA: Powerful Early Termination based Redundancy Analysis"
Youngkwang Lee, Hyojoon Yun, Younwoo Yoo, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be Published

201

"An Area-Efficient Systolic Array Redundancy Architecture for Reliable AI Accelerator"
Hayoung Lee, Jongho Park, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
To be Published

200

"GRAP: Efficient GPU-based Redundancy Analysis Using Parallel Evaluation for Cross Faults"
Seung-Ho Shin, Hayoung Lee, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol. 43, no. 8, pp. 2518-2531, August 2024

199

"A New ISA for High-Speed and Area-Efficient ALPG"
Juyong Lee, Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol. 71, no. 7. pp. 3358-3362, July 2024

198

"RA-Aware Fail Data Collection Architecture for Cost Reduction"
Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol. 32, no. 6, pp. 1136-1149, June 2024

197

"A New Zero-Overhead Test Method for Low-Power AI Accelerators"
Sangjun Lee, Jongho Park, Sungwhan Park, Hyemin Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol. 71, no. 5, pp. 2649-2653, May 2024