174

"Enhanced Post-bond Test Architecture for Bridge Defects Between the TSVs"
Jungil Mok, Hyeonchan Lim, Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
To be published,

173

"An In-DRAM BIST for 16 Gb DDR4 DRAM in the 2nd 10-nm-Class DRAM Process"
Jaewon Park, Jae Hoon Lee, Sang-Kil Park, Ki Chul Chun, Kyomin Sohn, Sungho Kang
IEEE Access
To be published,

172

"A New Logic Topology-based Scan Chain Stitching for Test-Power Reduction"
Sangjun Lee, Kyunghwan Cho, Sungki Choi, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol.67, no.12, pp.3432-3436, December

171

"Prediction based Error Correction for GPU Reliability with Low Overhead"
Hyunyul Lim, Tae Hyun Kim, Sungho Kang
Electronics
vol.9, no.11, pp.1849, November 2020

170

"Robust Secure Shield Architecture for Detection and Protection Against Invasive Attacks"
Young-woo Lee, Hyeonchan Lim, Youngkwang Lee, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.39, no.10, pp.3023-3034, October 2020

169

"Fine-Grained Defect Diagnosis for CMOL FPGA Circuits"
Jihye Kim, Hayoung Lee, Seokjun Jang, Sungho Kang
IEEE Access
vol.8, pp.163140-163151, September 2020

168

"A 3-D Rotation-Based Through-Silicon Via Redundancy Architecture for Clustering Faults"
Minho Cheong, Ingeol Lee, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.39, no.9, pp.1925-1934, September 2020

167

"Scan-Chain-Fault Diagnosis Using Regressions in Cryptographic Chips for Wireless Sensor Networks"
Hyunyul Lim, Minho Cheong, Sungho Kang
Sensors
vol.20, no.17, pp.4771, September 2020

166

"Advanced Low Pin Count Test Architecture for Efficient Multi-Site Testing"
Sungyoul Seo, Young-woo Lee, Hyeonchan Lim, Sungho Kang
IEEE transactions on Semiconductor Manufacturing
vol.33, no.3, pp.391-403, August 2020

165

"GPU-Based Redundancy Analysis Using Concurrent Evaluation"
Taehyun Kim, Hayoung Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.28, no.3, pp.805-817, March 2020


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