168

"Advanced Low Pin Count Test Architecture for Efficient Multi-Site Testing"
Sungyoul Seo, Young-woo Lee, Hyeonchan Lim, Sungho Kang
IEEE Transactions on Semiconductor Manufacturing
To be published..,

167

"Robust Secure Shield Architecture for Detection and Protection Against Invasive Attacks"
Young-woo Lee, Hyeonchan Lim, Youngkwang Lee, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be published..

166

"A Rotation Based Through-Silicon Via Redundancy Architecture for Clustering Faults"
Minho Cheong, Ingeol Lee, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be published..

165

"GPU-Based Redundancy Analysis Using Concurrent Evaluation"
Taehyun Kim, Hayoung Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.28, no.3, pp.805-817, March 2020

164

"Efficient Systolic-Array Redundancy Architecture for Offline/Online Repair"
Keewon Cho, Ingeol Lee, Hyeonchan Lim, and Sungho Kang
Electronics-Open Access Journal
vol.9, no.2, pp.338, February 2020

163

"Dynamic Built-In Redundancy Analysis for Memory Repair"
Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.27, no.10, pp 2365-2374, June 2019

162

"A Low-cost Concurrent TSV Test Architecture with Lossless Test Output Compression Scheme"
Young-woo Lee, Hyeonchan Lim, Sungyoul Seo, Keewon Cho, Sungho Kang
Public Library of Science One
vol.14, no.8, pp e0221043, August 2019

161

"Test Friendly Data Selectable Self-Gating (DSSG)"
Jihye Kim, Sangjun Lee, Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.27, no.8, pp 1972-1976, August 2019

160

"Highly Reliable Redundant TSV Architecture for Clustered Faults"
Ingeol Lee, Minho Cheong, Sungho Kang
IEEE Transactions on Reliability
vol.68, no.1, pp.237-247, March 2019

159

"An Efficient BIRA Utilizing Characteristics of Spare Pivot Faults"
Keewon Cho, Young-woo Lee, Sungyoul Seo, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.38, no.3, pp.551-561 , March 2019


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