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119	"A Delay Test Architecture for TSV with Resistive Open Defects in 3D-Stacked Memories" Hyungsu Sung, Kunsang Yoon, and Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.22 no.11 pp.2380-2387 , November 2014
118	"Recovery-Enhancing Task Scheduling for Multicore Processors under NBTI Impact" Hyejeong Hong; Jaeil Lim; Sungho Kang IEICE Electronics Express (ELEX) vol.11 no.11 pp.1-5, May 2014
117	"A New Fuse Architecture and a New Post-share Redundancy Scheme for Yield Enhancement in 3D-stacked Memories" Changwook Lee, Wooheon Kang, Donkoo Cho, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) vol.33 no.5 pp.786-797 , May 2014
116	"A New Multi-site Test for System-on-Chip using MSTAR(Multi-site Star Test ARchitecture)" Donkwan Han, Yong Lee, Sungho Kang ETRI Journal vol.36 no.2 pp.293-300, April 2014
115	"Interleaving Test Algorithm for Sub-threshold Leakage Current Defects in DRAM Considering the Equal Bit Line Stress" Hyoyoung Shin, Youngkyu Park, Gihwa Lee, Jungsik Park, and Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.22, no.4, pp.803-812, April 2014
114	"A novel test access mechanism for parallel testing of multi-core system" Taewoo Han, Inhyuk Choi, and Sungho Kang IEICE Electronics Express (ELEX) vol.11 no.6 pp.1-6, March 2014
113	"Dynamic thermal management for 3D multicore processors under process variations" Hyejeong Hong, Jaeil Lim, Hyunyul Lim, and Sungho Kang IEICE Electronics Express (ELEX) vol.10, no.23, pp.1-6, December 2013
112	"A Flexible Programmable Memory BIST for Embedded Single-Port Memory and Dual-Port Memory" Youngkyu Park, Hong-sik Kim, Inhyuk Choi, and Sungho Kang ETRI Journal vol.35, no.5, pp.808-818, October 2013
111	"Thermal-aware dynamic voltage frequency scaling for many-core processors under process variations" Hyejeong Hong; Jaeil Lim; Hyunyul Lim; Sungho Kang IEICE Electronics Express (ELEX) vol.10, no.14, pp.1-6, July 2013
110	"Efficient Multi-ste Testing using ATE Channel Sharing" Kyoung-woon Eom, Dong-kwan Han, Yong Lee, Hak-song Kim and Sungho Kang Journal of Semiconductor Technology and Science (JSTS) vol.13, no.3, pp. 259-262, June, 2013

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