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144	"R2-TSV: A Repairable and Reliable TSV Set Structure Reutilizing Redundancies" Jaeseok Park, Minho Cheong, Sungho Kang IEEE Transactions on Reliability vol.66, no.2, pp.458-466, June 2017
143	"Chain-based Approach for Fast Through-Silicon-Via Coupling Delay Estimation" Jaewon Jang, Minho Cheong, Jin-Ho Ahn, Sung Kyu Lim, Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.25, no.3, pp.1178-1182, March 2017
142	"Hardware-Efficient Built-in Redundancy Analysis for Memory with Various Spares" Jooyoung Kim, Woosung Lee, Keewon Cho, and Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.25, no.3, pp.844-856, March 2017
141	"Low Cost Endurance Test-pattern Generation for Multi-level Cell Flash Memory" Jaewon Cha, Keewon Cho, Seunggeon Yu, Sungho Kang Journal of Semiconductor Technology and Science (JSTS) vol.17, no.1, pp.147-155, February 2017
140	"A Low-cost DAC BIST Structure using a Resistor Loop" Jaewon Jang, Heetae Kim, Sungho Kang PLoS One vol.12, no.2, e0172331, February 2017
139	"FRESH: A New Test Result Extraction Scheme for Fast TSV Tests" Jaeseok Park, Hyunyul Lim, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.36, no.2, pp.336-345, February 2017
138	"An On-Chip Error Detection Method to Reduce the Post-Silicon Debug Time" Hyunggoy Oh, Taewoo Han, Inhyuk Choi, Sungho Kang IEEE Transactions on Computers vol.66, no.1, pp.38-44, January 2017
137	"A Survey of Repair Analysis Methods for Memories" Keewon Cho, Wooheon Kang, Hyungjun Cho, Changwook Lee, Sungho Kang ACM Computing Surveys vol.49, no.3, pp.47:1-47:41, October 2016
136	"A New 3-D Fuse Architecture to Improve Yield of 3-D Memories" Wooheon Kang, Changwook Lee, Hyunyul Lim, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.35, no.10, pp.1763-1767, October 2016
135	"Parallelized Network on Chip-reused Test Access Mechanism for Multiple Identical Cores" Taewoo Han, Inhyuk Choi, Hyunggoy Oh, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.35, no.7, pp.1219-1223, July 2016

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