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153	"Thermal Aware Test Scheduling for NTV Circuit " Jaeil Lim, Hyunggoy Oh, Heetae Kim, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.37, no.4, pp.906-910, March 2018
152	"Fast Built-in Redundancy Analysis Based on Sequential Spare Line Allocation" Hayoung Lee, Jooyoung Kim, Keewon Cho, Sungho Kang IEEE Transactions on Reliability vol.67, no.1, pp.264-273, March 2018
151	"An Area-efficient BIRA with 1D Spare Segments" Donghyun Kim, Hayoung Lee, Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.26, no.1, pp.206-210, January 2018
150	"A novel X-filling method for capture power reduction" Heetae Kim, Hyunggoy Oh, Jaeil Lim, Sungho Kang IEICE Electronics Express (ELEX) vol.14, no.23, pp.1-6, November 2017
149	"Grouping-based TSV Test Architecture for Resistive Open and Bridge Defects in 3D-ICs" Young-woo Lee, Hyeonchan Lim, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.36, no.10, pp.1759-1763, October 2017
148	"DRAM-based Error Detection Method to Reduce the Post-Silicon Debug Time for Multiple Identical Cores" Hyunggoy Oh, Inhyuk Choi, Sungho Kang IEEE Transactions on Computers vol.66, no.9, pp.1504-1517, September 2017
147	"DVFS-aware refresh management for 3D DRAM over processor architecture " Jaeil Lim, Heetae Kim, Hyunggoy Oh, Sungho Kang IET Electronics Letters vol.53,no.14, pp.910-912, July 2017
146	"Reconfigurable scan architecture for Test Power and Data Volume Reduction" Hyunggoy Oh, Heetae Kim, Jaeil Lim, Sungho Kang IEICE Electronics Express (ELEX) vol.14, no.13, pp.1-7, July 2017
145	"Proof of Concept of Home IoT Connected Vehicles" Younsun Kim, Hyunggyo Oh, Sungho Kang Sensors vol.17, no.6, pp.1289:1-1289:13., June 2017
144	"R2-TSV: A Repairable and Reliable TSV Set Structure Reutilizing Redundancies" Jaeseok Park, Minho Cheong, Sungho Kang IEEE Transactions on Reliability vol.66, no.2, pp.458-466, June 2017

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