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166	"Advanced Low Pin Count Test Architecture for Efficient Multi-Site Testing" Sungyoul Seo, Young-woo Lee, Hyeonchan Lim, Sungho Kang IEEE transactions on Semiconductor Manufacturing vol.33, no.3, pp.391-403, August 2020
165	"GPU-Based Redundancy Analysis Using Concurrent Evaluation" Taehyun Kim, Hayoung Lee, and Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.28, no.3, pp.805-817, March 2020
164	"Efficient Systolic-Array Redundancy Architecture for Offline/Online Repair" Keewon Cho, Ingeol Lee, Hyeonchan Lim, and Sungho Kang Electronics-Open Access Journal vol.9, no.2, pp.338, February 2020
163	"Dynamic Built-In Redundancy Analysis for Memory Repair" Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.27, no.10, pp.2365-2374, June 2019
162	"A Low-cost Concurrent TSV Test Architecture with Lossless Test Output Compression Scheme" Young-woo Lee, Hyeonchan Lim, Sungyoul Seo, Keewon Cho, Sungho Kang Public Library of Science One vol.14, no.8, pp e0221043, August 2019
161	"Test Friendly Data Selectable Self-Gating (DSSG)" Jihye Kim, Sangjun Lee, Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.27, no.8, pp.1972-1976, August 2019
160	"Highly Reliable Redundant TSV Architecture for Clustered Faults" Ingeol Lee, Minho Cheong, Sungho Kang IEEE Transactions on Reliability vol.68, no.1, pp.237-247, March 2019
159	"An Efficient BIRA Utilizing Characteristics of Spare Pivot Faults" Keewon Cho, Young-woo Lee, Sungyoul Seo, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.38, no.3, pp.551-561 , March 2019
158	"TSV Repair Architecture for Clustered Faults" Jaewon Jang, Minho Cheong, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.38, no.1, pp.190-194 , January 2019
157	"Test Resource Reused Debug Scheme to Reduce the Post-Silicon Debug Cost" Inhyuk Choi, Hyunggoy Oh, Young-woo Lee, Sungho Kang IEEE Transactions on Computers vol.67, no.12, pp1835-1839, December 2018

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