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185	"Multi-Bank Optimized Redundancy Analysis Using Efficient Fault Collection" Hogyeong Kim, Hayoung Lee, Donghyun Han, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.41, no.8, pp.2739-2752, August 2022
184	"ECMO: ECC Architecture Reusing Content Addressable Memories for Obtaining High Reliability in DRAM" Hayoung Lee, Younwoo Yoo, Seung Ho Shin, and Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.30, no.6, pp.781-793, June 2022
183	"Herringbone Based TSV Architecture for Clustered Fault Repair and Aging Recovery" Sangmin Park, Minho Cheong, Donghyun Han, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.41, no.4, pp.1142-1153, April 2022
182	"Reduced-Pin-Count BOST for Test-Cost Reduction" Youngkwang Lee, Young-woo Lee, Sungyoul Seo, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.41, no.3, pp.750-761, March 2022
181	"ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory" Donghyun Han, Hayoung Lee, Seungtaek Lee, and Sungho Kang IEEE Access vol.9, pp.133274-133288, October 2021
180	"Low-Power Scan Correlation-Aware Scan Cluster Reordering for Wireless Sensor Networks" Sangjun Lee, Kyunghwan Cho, Jihye Kim, Jongho Park, Inhwan Lee, and Sungho Kang Sensors vol.21, no.18, pp.6111, September 2021
179	"Reconfigurable Scan Architecture for High Diagnostic Resolution" Seokjun Jang, Jihye Kim, Sungho Kang IEEE Access vol.9, pp.120537-120550, August 2021
178	"A Low-Power BIST Scheme Using Weight-Aware Scan Grouping and Scheduling for Automotive ICs" Kwonhyoung Lee, Sangjun Lee, Jongho Park, Inhwan Lee, and Sungho Kang IEEE Access vol.9, pp.116115-116132, August 2021
177	"A Secure Scan Architecture Protecting Scan Test and Scan Dump Using Skew-based Lock and Key" Hyungil Woo, Seokjun Jang and Sungho Kang IEEE Access vol.9, pp.102161-102176, July 2021
176	"Enhanced Post-bond Test Architecture for Bridge Defects Between the TSVs" Jungil Mok, Hyeonchan Lim, Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.29, no.6, pp.1164-1177, June 2021

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