184

"ECMO: ECC Architecture Reusing Content Addressable Memories for Obtaining High Reliability in DRAM"
Hayoung Lee, Younwoo Yoo, Seung Ho Shin, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.30, no.6, pp.781-793, June 2022

183

"Herringbone Based TSV Architecture for Clustered Fault Repair and Aging Recovery"
Sangmin Park, Minho Cheong, Donghyun Han, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.41, no.4, pp.1142-1153, April 2022

182

"Reduced-Pin-Count BOST for Test-Cost Reduction"
Youngkwang Lee, Young-woo Lee, Sungyoul Seo, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.41, no.3, pp.750-761, March 2022

181

"ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory"
Donghyun Han, Hayoung Lee, Seungtaek Lee, and Sungho Kang
IEEE Access
vol.9, pp.133274-133288, October 2021

180

"Low-Power Scan Correlation-Aware Scan Cluster Reordering for Wireless Sensor Networks"
Sangjun Lee, Kyunghwan Cho, Jihye Kim, Jongho Park, Inhwan Lee, and Sungho Kang
Sensors
vol.21, no.18, pp.6111, September 2021

179

"Reconfigurable Scan Architecture for High Diagnostic Resolution"
Seokjun Jang, Jihye Kim, Sungho Kang
IEEE Access
vol.9, pp.120537-120550, August 2021

178

"A Low-Power BIST Scheme Using Weight-Aware Scan Grouping and Scheduling for Automotive ICs"
Kwonhyoung Lee, Sangjun Lee, Jongho Park, Inhwan Lee, and Sungho Kang
IEEE Access
vol.9, pp.116115-116132, August 2021

177

"A Secure Scan Architecture Protecting Scan Test and Scan Dump Using Skew-based Lock and Key"
Hyungil Woo, Seokjun Jang and Sungho Kang
IEEE Access
vol.9, pp.102161-102176, July 2021

176

"Enhanced Post-bond Test Architecture for Bridge Defects Between the TSVs"
Jungil Mok, Hyeonchan Lim, Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.29, no.6, pp.1164-1177, June 2021

175

"Effective Spare Line Allocation Built-in Redundancy Analysis with Base Common Spare for Yield Improvement of 3D Memory"
Donghyun Han, Hayoung Lee, and Sungho Kang
IEEE Access
vol.9, pp.76716-76729, May 2021