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193	"Scan Chain Architecture with Data Duplication for Multiple Scan Cell Fault Diagnosis" Sunghoon Kim, Seokjun Jang, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.42, no.8, pp.2717-2727, August 2023, August 2023
192	"TRUST: Through-Silicon Via Repair Using Switch Matrix Topology" Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.42, no.7, pp.2377-2390, July 2023, July 2023
191	"Shift Left Quality Management System (QMS) Using a 3D Matrix Scanning Method on System on a Chip" Yong Lee, Seokjun Jang, Sungho Kang IEEE Transactions on Circuits and Systems II: Express Briefs vol.70, no.4, pp.1580-1584, April 2023
190	"TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM" Youngkwang Lee, Donghyun Han, and Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.31, no.4, pp.578-590, April 2023
189	"Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture" Youngkwang Lee, Donghyun Han, Sooryeong Lee, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.42, no.1, pp.308-321, January 2023
188	"A Hybrid Test Scheme for Automotive IC in Multi-site Testing" Hyeonchan Lim, Hyojoon Yun, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.41, no.12, pp.5671-5680, December 2022
187	"Scan Cell Modification for Intra Cell-Aware Scan Chain Diagnosis" Hyeonchan Lim, Hyojoon Yun, Sungho Kang IEEE Transactions on Circuits and Systems II: Express Briefs vol.69, no.11, pp.4498-4502, November 2022
186	"SPAR: A New Test Point Insertion Using Shared Points for Area Overhead Reduction" Gyungbin Kim, Minho Cheong, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.41, no.11, pp.4939-4951, November 2022
185	"Multi-Bank Optimized Redundancy Analysis Using Efficient Fault Collection" Hogyeong Kim, Hayoung Lee, Donghyun Han, and Sungho Kang IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems vol.41, no.8, pp.2739-2752, August 2022
184	"ECMO: ECC Architecture Reusing Content Addressable Memories for Obtaining High Reliability in DRAM" Hayoung Lee, Younwoo Yoo, Seung Ho Shin, and Sungho Kang IEEE Transactions on Very Large Scale Integration Systems vol.30, no.6, pp.781-793, June 2022

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