199

"A New ISA for High-Speed and Area-Efficient ALPG"
Juyong Lee, Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol.71, no.7. pp.3358-3362, July 2024

198

"RA-Aware Fail Data Collection Architecture for Cost Reduction"
Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.32, no.6, pp.1136-1149, June 2024

197

"A New Zero-Overhead Test Method for Low-Power AI Accelerators"
Sangjun Lee, Jongho Park, Sungwhan Park, Hyemin Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol.71, no.5, pp.2649-2653, May 2024

196

"A New Fail Address Memory Architecture for Cost-Effective ATE"
Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.43, no.4, pp.1260-1273, April 2024

195

"Reconfigurable Multi-bit Scan Flip-Flop for Cell-Aware Diagnosis"
Hyeonchan Lim, Taehyun Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol.71, no.4, pp.2024-2028, April 2024

194

"STRAIT: Self-Test and Self-Recovery for AI Accelerator"
Hayoung Lee, Jihye Kim, Jongho Park, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.42, no.9, pp.3092-3104, September 2023, September 2023

193

"Scan Chain Architecture with Data Duplication for Multiple Scan Cell Fault Diagnosis"
Sunghoon Kim, Seokjun Jang, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.42, no.8, pp.2717-2727, August 2023, August 2023

192

"TRUST: Through-Silicon Via Repair Using Switch Matrix Topology"
Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.42, no.7, pp.2377-2390, July 2023, July 2023

191

"Shift Left Quality Management System (QMS) Using a 3D Matrix Scanning Method on System on a Chip"
Yong Lee, Seokjun Jang, Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol.70, no.4, pp.1580-1584, April 2023

190

"TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM"
Youngkwang Lee, Donghyun Han, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.31, no.4, pp.578-590, April 2023