204

"TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM"
Donghyun Han, Duyeon Won, Sunghoon Kim, and Sungho Kang
IEEE Transactions on Reliability
To be Published

203

"PASS: Pattern-Sequence-Authentication-based Secure Scan against Reverse Engineering Attacks"
Seokjun Jang, Youngki Moon, Duyeon Won, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be Published

202

"PETRA: Powerful Early Termination based Redundancy Analysis"
Youngkwang Lee, Hyojoon Yun, Younwoo Yoo, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be Published

201

"An Area-Efficient Systolic Array Redundancy Architecture for Reliable AI Accelerator"
Hayoung Lee, Jongho Park, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
To be Published

200

"GRAP: Efficient GPU-based Redundancy Analysis Using Parallel Evaluation for Cross Faults"
Seung-Ho Shin, Hayoung Lee, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol. 43, no. 8, pp. 2518-2531, August 2024

199

"A New ISA for High-Speed and Area-Efficient ALPG"
Juyong Lee, Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol. 71, no. 7. pp. 3358-3362, July 2024

198

"RA-Aware Fail Data Collection Architecture for Cost Reduction"
Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol. 32, no. 6, pp. 1136-1149, June 2024

197

"A New Zero-Overhead Test Method for Low-Power AI Accelerators"
Sangjun Lee, Jongho Park, Sungwhan Park, Hyemin Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol. 71, no. 5, pp. 2649-2653, May 2024

196

"A New Fail Address Memory Architecture for Cost-Effective ATE"
Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol. 43, no. 4, pp. 1260-1273, April 2024

195

"Reconfigurable Multi-bit Scan Flip-Flop for Cell-Aware Diagnosis"
Hyeonchan Lim, Taehyun Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol. 71, no. 4, pp. 2024-2028, April 2024