129

"A New Accelerated Endurance Test for Terabit NAND Flash Memory using Interference Effect"
Jaewon Cha and Sungho Kang
IEEE Transactions on Semiconductor Manufacturing
vol.28, no.3, pp.399-407, August 2015

128

"Majority based Test Access Mechanism for Parallel Testing of Multiple Identical Cores"
Taewoo Han, Inhyuk Choi, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.23, no.8, pp.1439-1447, August 2015

127

"Eco Assist Techniques through Real-time Monitoring of BEV Energy Usage Efficiency"
Younsun Kim, Ingeol Lee, and Sungho Kang
Sensors
vol.15, no.7, pp.14946-14959, July 2015

126

"Multi-operation based Constrained Random Verification for On-Chip Memory"
Hyeonuk Son, Jaewon Jang, Heetae Kim, and Sungho Kang
Journal of Semiconductor Technology and Science (JSTS)
vol.15, no.3, pp.423-426, June 2015

125

"Histogram-based Calibration Method for Pipeline ADCs"
Hyeonuk Son, Jaewon Jang, Heetae Kim, and Sungho Kang
PLOS ONE
vol.10, no.6, pp.129736, June 2015

124

"Reduced-Code Test Method Using Sub-Histograms for Pipelined ADCs"
Hyeonuk Son, Jaewon Jang, Heetae Kim, and Sungho Kang
IEICE Electronics Express (ELEX)
vol.12, no.12, pp.20150417, June 2015

123

"A 3 Dimensional Built-In Self-Repair Scheme for Yield Improvement of 3 Dimensional Memories"
Wooheon Kang, Changwook Lee, Hyunyul Lim, Sungho Kang
IEEE Transactions on Reliability
vol.64, no.2, pp.586-595, June 2015

122

"A Novel Massively Parallel Testing Method using Multi-root for High Reliability"
Haksong Kim, Yong Lee, and Sungho Kang
IEEE Transactions on Reliability
vol.64 no.1 pp.486-496, March 2015

121

"A New Thermal-Aware Voltage Island Formation for 3D Many-Core Processors"
Hyejeong Hong, Jaeil Lim, Hyunyul Lim, and Sungho Kang
ETRI Journal
vol.37, no.1, pp.118-127, February 2015

120

"A BIRA for Memories with an Optimal Repair Rate Using Spare memories as an Address Mapping Table for Area Reduction"
Wooheon Kang, Hyungjun Cho, Joohwan Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.22 no.11 pp.2336-2349, November 2014