229

"High-Speed Redundancy Analysis for Complex Spare Structures"
Youngkwang Lee, Younwoo Yoo, Seung Ho Shin, Byungsoo Kim, Eugene Jeong, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be Published

228

"A Low Area Built-In Self-Repair Using Hybrid Fault Address Memory for HBM"
Byungsoo Kim, Seung Ho Shin, Youngki Moon, Eugene Jeong, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
To be Published

227

"STAR-PIM: Self-Test and Repair Structure for Processing-in Memory with Adder Tree-Based MAC"
Seung Ho Shin, Younwoo Yoo, Youngki Moon, Nuri Son, Dahoon Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems I: Regular Papers
To be Published

226

"FADE: Fault-Aware Adaptive On-Die ECC for Improving Robustness"
Youngki Moon, Juyong Lee, Nayeun Kim, Yeonho Choi, Byungsoo Kim, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.34, no.2, pp.707-710, February, 2026

225

"CLAPS: A Graph Clustering Based Approach for Partial Scan Design"
Jaeyoung Joung, Sangjun Lee, Jongho Park, Jaehyun Kim, Laesang Jung, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.45, no.1, pp.396-406, January 2026

224

"TOPS: Topology-based Partial Scan for Stuck-at and Delay Testing"
Sangjun Lee, Jongho Park, Jaeyoung Joung, Jaehyun Kim, Laesang Jung, and Sungho Kang
IEEE Transactions on Circuits and Systems I: Regular Papers
vol.73, no.1, pp.492-501, January 2026

223

"VASE: Vector Memory Using Bit-Level Address Segmentation for High-Speed Memory Testing"
Sooryeong Lee, Juyong Lee, Hayoung Lee, and Sungho Kang
IEEE Transactions on Circuits and Systems I: Regular Papers
vol.73, no.1, pp.334-346, January 2026

222

"Test Cycle Reduction for TSV Test Using Streaming Scan Network on 3-D IC"
Sunghoon Kim, Donghyun Han, Dayoung Kim, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
vol.34, no.1, pp.307-311, January 2026

221

"A New Logic BIST for Complete Fault Detection Using Previous Scan-In Bit Dependency"
Jongho Park, Sangjun Lee, Jaehyun Kim, Hanseong Cho, Nayeun Kim, and Sungho Kang
IEEE Access
vol.13, pp.180264-180275, October 2025

220

"TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM"
Donghyun Han, Duyeon Won, Sunghoon Kim, and Sungho Kang
IEEE Transactions on Reliability
vol.74, no.3, pp.4143-4157, September 2025