200

"GRAP: Efficient GPU-based Redundancy Analysis Using Parallel Evaluation for Cross Faults"
Seung-Ho Shin, Hayoung Lee, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
To be Published

199

"A New ISA for High-Speed and Area-Efficient ALPG"
Juyong Lee, Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
To be Published

198

"A New Zero-Overhead Test Method for Low-Power AI Accelerators"
Sangjun Lee, Jongho Park, Sungwhan Park, Hyemin Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
To be Published

197

"RA-Aware Fail Data Collection Architecture for Cost Reduction"
Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Very Large Scale Integration Systems
To be Published

196

"A New Fail Address Memory Architecture for Cost-Effective ATE"
Hayoung Lee, Sooryeong Lee, and Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol. 43, no. 4, pp. 1260-1273, April 2024

195

"Reconfigurable Multi-bit Scan Flip-Flop for Cell-Aware Diagnosis"
Hyeonchan Lim, Taehyun Kim, and Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol. 71, no. 4, pp. 2024-2028, April 2024

194

"STRAIT: Self-Test and Self-Recovery for AI Accelerator"
Hayoung Lee, Jihye Kim, Jongho Park, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.42, no.9, pp.3092-3104, September 2023,

193

"Scan Chain Architecture with Data Duplication for Multiple Scan Cell Fault Diagnosis"
Sunghoon Kim, Seokjun Jang, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.42, no.8, pp.2717-2727, August 2023,

192

"TRUST: Through-Silicon Via Repair Using Switch Matrix Topology"
Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
vol.42, no.7, pp.2377-2390, July 2023,

191

"Shift Left Quality Management System (QMS) Using a 3D Matrix Scanning Method on System on a Chip"
Yong Lee, Seokjun Jang, Sungho Kang
IEEE Transactions on Circuits and Systems II: Express Briefs
vol.70, no.4, pp.1580-1584, April 2023